HAD8613-A Die Bonder for Precision Mini-Chip Die Attach

A mini-chip die attach that drifts a few microns off the pad doesn't fail on the bench—it fails during thermal cycling, after the module has shipped. Hand placement and single-head bonding can't hold ±10 μm across a high-mix lot, so yield drops and rework climbs. The HAD8613-A pairs a linear die-bonder head with a voice-coil second head and automated vision alignment to place chips from 3×5 to 120×120 mil at ±10 μm, repeatably, on PCB or substrate.

The cost you haven't named

• Micron-level misalignment. Mini chips under 120×120 mil leave almost no pad tolerance; a few microns of offset breaks the wire-bond window or the thermal path and shows up only in the field.
• Single-head bottlenecks. A head that must pick, align, and bond in series limits cycle time; high-mix lots with frequent size changes stall even further.
• Manual vision checks. Operator-aligned placement shifts from shift to shift and can't hold ±10 μm or ±1° angle on every part.
• Wafer and substrate mismatch. If the holder and ring size don't match the job, setup time eats away the gains the machine should deliver.

The Four-Point Die Attach Audit

Frame the purchase as a die-attach audit so the configuration fits your chip set and substrate. Call it the Four-Point Die Attach Audit.

1. Define the chip envelope. List every chip size from 3×5 to 120×120 mil and the required placement angles (0° and 90°) so the bond head and holder match your real device range.

2. Set the accuracy budget. Fix positioning at ±10 μm and angle at ±1°, then confirm the vision system resolves the parts; at 50 mil the vision holds ±3 μm, which is the floor the bond must stay under.

3. Score the dual-head gain. Measure how the linear head and voice-coil second head split pick and bond so cycle time stays near 1200 ms instead of doubling on single-head runs.

4. Confirm substrate and ring fit. Verify PCB holder length 100–260 mm and width 60–150 mm, and the 8-inch iron-ring wafer capacity, so setup matches the substrate and wafer you actually run.

The vehicle: HAD8613-A Die Bonder

The HAD8613-A is a precision die bonder for semiconductor and LED mini-chip assembly, built around a linear bond head, a voice-coil second head, and automated vision alignment at ±10 μm.

• Define the chip envelope → dual-head coverage. One head picks the chip while the other completes the bond, placing mini chips 3×5–120×120 mil with 0° and 90° orientation for QFP and BGA-adjacent work.
• Set the accuracy budget → automated vision alignment. A 256-level grey vision system at 720×540 px holds ±10 μm positioning and ±1° angle, removing operator variance from every placement.
• Score the dual-head gain → 1200 ms cycle. Splitting pick and bond across two heads keeps cycle time near 1200 ms, so low-volume, high-mix lots don't pay a single-head penalty.
• Confirm substrate and ring fit → modular holder. The PCB holder covers L 100–260 mm × W 60–150 mm and supports an 8-inch iron-ring wafer, so the same base handles different substrates.

Specification note: die bond pressure (30–250 g), cycle time, and holder dimensions should be confirmed at quotation, because they depend on your chip size, substrate type, and target throughput.

Specifications

| Parameter | Value |

| --- | --- |

| Positioning accuracy | ±10 μm |

| Placement angle | 0° and 90° |

| Angle accuracy | ±1° |

| Chip size range | 3×5 – 120×120 mil |

| Die bond pressure | 30 – 250 g |

| Cycle time | 1200 ms |

| Max wafer ring size | 8" (iron ring) |

| Vision system | 256-level grey, 720×540 px, ±3 μm @ 50 mil |

| PCB holder size | L 100–260 mm, W 60–150 mm |

| Machine dimensions | 1600 × 1420 × 1840 mm |

The loop: re-audit die attach every quarter

Device mixes change as new packages enter the line. Build a loop: every quarter, repeat the Four-Point Die Attach Audit, compare actual placement yield and cycle time against your baseline, and review vision calibration and bond-pressure settings with your process lead. If a new chip size or substrate appears, reconfirm the holder and pressure range before volume builds—not after. The HAD8613-A's modular holder and dual-head layout give you margin to absorb that change; the loop is what keeps accuracy at ±10 μm instead of drifting as lots change.

Your next step

Send us your chip sizes, substrate dimensions, and target cycle time. We'll return a die-attach review showing where the HAD8613-A fits, which holder and pressure settings to specify, and what to confirm at quotation for your line. Reach Jason at jasonwu@smthelp.com or on WhatsApp +86 13602562576.

FAQ

What chip sizes can the HAD8613-A bond?

Mini chips from 3×5 to 120×120 mil, placed at 0° and 90°, for semiconductor and LED devices.

What accuracy does it hold?

Positioning accuracy is ±10 μm with ±1° angle accuracy, supported by a vision system that resolves ±3 μm at 50 mil.

Why two heads?

A linear bond head and a voice-coil second head split pick and bond, keeping cycle time near 1200 ms instead of doubling on a single head.

What substrates and wafers are supported?

PCB holders from L 100–260 mm × W 60–150 mm, and an 8-inch iron-ring wafer, with a modular layout for different substrates.

Is the machine configurable?

Yes—the standard configuration is customizable, and buyers should confirm parameters at quotation for their chip and substrate mix.

Jason Wu

Founder & CEO, Southern Machinery (Shenzhen Southern Machinery Sales and Service Co., Ltd.)

Email: jasonwu@smthelp.com / info@smthelp.com

WhatsApp: +86 13602562576

Catalog & manuals: file.autoinsertion.com | Machine photos: ph.smthelp.com

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