Aug 7, 2026
HAD8613-A Die Bonder for Precision Mini-Chip Die Attach
A dual-head die bonder that places mini chips from 3×5 to 120×120 mil onto PCBs or substrates with ±10 μm accuracy, built for semiconductor and LED assembly.
Tag
Tag
A dual-head die bonder that places mini chips from 3×5 to 120×120 mil onto PCBs or substrates with ±10 μm accuracy, built for semiconductor and LED assembly.
Now Playing
Powering the Future
The Southern Machinery Anthem